The invention discloses a method for producing a leadless gold-plated circuit board. The method comprises the following steps: selecting a copper wire connected with a gold finger, and determining a first copper wire segment having a distance with the gold finger within a first threshold range and a second copper wire segment having a distance with the gold finger within a second threshold range on the copper wire; on the basis of the original design wire width of the copper wire, carrying out a compensation widening treatment on the wire widths of the first copper wire segment and the second copper wire segment, wherein a first compensation value of the wire width compensation widening of the first copper wire segment gradually becomes small on a direction away from the gold finger; and manufacturing the leadless gold-plated circuit board according to a circuit graphic file. After the method for producing the leadless gold-plated circuit board is adopted, in an ultra-roughening treatment of the circuit board before solder resist, the wire width compensation widening part is etched by the Javani effect, and the final wire width of the copper wire is close to the theoretical design wire width. In addition, the existing production conditions and the final design requirements of circuit board products do not need to be changed, the stability in the manufacture procedure will not be influenced, and no adverse effect is generated on the product performance.