A wafer connector is disclosed in which a plurality of twin-axial wires are terminated to the tails of ground and signal terminals of the connector. Each twin-axial wire includes a pair of signal wires enclosed in a conductive sheath. A conductive grounding clamp is provided that contacts the sheaths of the twin-axial wires and holds them together as a unit to facilitate the attachment of the wires to the connector terminal tails. The clamp has two opposing halves that cooperatively define openings which receive the twin-axial wires and flat, interconnecting portions extending between the openings that provide contact points where the grounding clamp may be attached to the connector terminal tails.