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发明授权
CN105579187B 激光加工装置 有权

激光加工装置
摘要：
激光加工装置(1)包含：光扫描型激光加工机(10)，其具有加工头(11)，该加工头(11)沿第1方向以及与所述第1方向相交叉的第2方向移动，对工件(2)照射激光而对所述工件(2)进行加工；第1刻印装置(20)，其设置于所述光扫描型激光加工机(10)的所述第1方向的一侧，对所述工件(2)施加标记；第2刻印装置(30)，其设置于所述光扫描型激光加工机(10)的所述第1方向的另一侧，对所述工件施加标记；以及托盘(40)，其装载成为所述光扫描型激光加工机(10)的加工对象的所述工件(2)，且在所述第1刻印装置(20)和所述第2刻印装置(30)之间沿所述第1方向移动，由此，在提高激光加工装置(1)的生产率的同时，抑制设置空间的增加。
摘要（英）：

A laser machining apparatus includes: an optical-scanning laser machining device that includes a machining head, which moves in a first direction and a second direction intersecting the first direction and emits laser light on a workpiece to machine the workpiece; a first marking device that is provided on one side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; a second marking device that is provided on another side of the optical-scanning laser machining device in the first direction and puts a mark on the workpiece; and a pallet on which the workpiece to be machined by the optical-scanning laser machining device is loaded and which moves in the first direction between the first marking device and the second marking device.

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