The invention provides a curing system that is useful for curing materials that consume carbon dioxide as a reagent. The system has a curing chamber that contains the material to be cured and a gas that contains carbon dioxide. The system includes apparatus that can deliver carbon dioxide to displace ambient air upon loading the system, that can provide carbon dioxide as it is needed and as it is consumed, that can control carbon dioxide concentration, temperature and humidity in the curing chamber during the curing cycle and that can record and display to a user the variables that occur during the curing process. A method of curing a material which requires CO2 as a curing reagent is also described.