The invention provides an intelligent ultralight and ultrathin electronic component capable of being rubbed and folded and a fabrication method thereof. The electronic component is an electronic component which is obtained through micro-etching on a conductive fabric, is provided with an electronic component conductive pattern and takes the fabric as an insulation substrate. The fabrication method comprises the following steps of firstly, carrying out engraving and protection on a metal coat-plating layer of the conductive fabric; and finally, carrying out metal micro-etching to obtain the electronic component. By removing residual metal coat-plating layer on the conductive fabric, the intelligent ultralight and ultrathin electronic component with a special pattern is obtained, and the pattern can be custom-designed according to application demands and is flexible and variable; by taking the fabric as the substrate, the electronic component is light, thin and soft, can be rubbed and washed, is free from folding, and has high corrosion resistance; and moreover, based on the property of the fabric substrate, the electronic component can be processed in a wide temperature range of (-40) DEG C to (+90) DEG C. The electronic component can be applied to the fields of aerospace, national defense and military, information safety, electronic industry, automobile industry, textile industry, medical and health services, energy saving and environmental protection, architectural decoration, internet of things and the like.