The embodiment of the invention provides a parameter adjustment method and system for sputtering film-forming and relates to the field of displaying. By means of the adjustment method, the surface evenness of a flexible substrate formed by a substrate base plate and a sputtering deposited film deposited on the substrate base plate can be improved, the overall deformation rate of the flexible substrate is lowered, and the bending performance of the flexible substrate can be improved. The adjustment method comprises the steps of monitoring at least one variable of the crystallization nucleation temperature difference quantity of different regions on the substrate base plate, the film-forming thickness variable quantity of different regions on the substrate base plate and deformation quantity of the substrate base plate, and adjusting parameters of sputtering equipment if the monitored variable exceeds a threshold value of the variable so as to reduce the monitored variable. The parameter adjustment method and system for sputtering film-forming are used for parameter adjustment of the sputtering process.