The purpose of the present invention is to provide a photocurable composition which is suitable for temporary fixing by means of active energy rays in a state bonded to an adherend, which does not release even when processing operations are performed on the adherend after bonding and which can be favorably released in a 90-200 DEG C release medium without dissolving the cured product. This photocurable composition contains (A) a compound which has two or more acrylic groups inside the molecule that do not have a urethane bond and do have at least one bond in the main skeleton selected from ester bonds and ether bonds, (B) at least one species selected from diethyl acrylamide and dimethyl acrylamide, (C) water, and (D) a photoinitiator. Either 8-25 parts by mass of component (C) are added per total 100 parts by mass of (A) and (B) and the cured product has release properties in 90-100 DEG C hot water, or, 1-8 parts by mass of component (C) are added per total 100 parts by mass of (A) and (B) and the cured product has release properties in a 100-200 DEG C medium.