The invention provides optical semiconductor lighting equipment. The optical semiconductor lighting equipment comprises heat dissipation pieces, a light emitting module, optical components and steps. The light emitting module makes contact with the heat dissipation pieces and comprises linings, wherein each lining is provided with one or more optical semiconductor devices. The optical components are coupled to the heat dissipation pieces and cover the light emitting module. Each optical component comprises a lining locating groove. Each lining locating groove is in the shape corresponding to that of the periphery of the corresponding lining. Each step is in the shape corresponding to that of a cut groove in the periphery of the corresponding lining. By the adoption of the optical semiconductor lighting equipment, the optical semiconductor devices and a circuit component can be protected against pressure, pressure resistance is achieved, efficient and simple assembly and fastening are achieved, and the required light distribution is achieved.