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CN105786041A 功率散热装置及其散热控制方法 无效 - 撤回

功率散热装置及其散热控制方法
摘要：
一种功率散热装置及其散热控制方法，功率散热装置包含一导热层、一散热器及至少一致冷芯片。导热层具有相对的一吸热面及一放热面。散热器热接触于导热层的放热面。致冷芯片嵌设于导热层。其中，导热层具有一有效导热区域，且有效导热区域正交投影至吸热面的投影面与致冷芯片投影至吸热面的投影面的面积比值介于0.15至0.58之间。
摘要（英）：

A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one thermoelectric cooling chip. The heat-conducting layer has a heat-absorbing-surface and a heat-dissipating-surface which are opposite to each other. The heat sink is in thermal contact with the heat-dissipating-surface of the heat-conducting layer. The at least one thermoelectric cooling chip is embedded in the heat-conducting layer. The heat-conducting layer has an effective heat-conducting-region. A1 is the area on the heat-absorbing-surface which the effective heat-conducting-region projects on, and A2 is the area on the heat-absorbing-surface which the thermoelectric cooling chip projects on. The ratio of A2 to A1 is between 0.15 and 0.58.

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