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CN105789172A 晶片封装体及其制造方法 无效 - 撤回

晶片封装体及其制造方法
摘要：
一种晶片封装体及其制造方法，该晶片封装体包含：一晶片，具有一导电垫、以及相对的一第一表面与一第二表面，其中导电垫位于第一表面；一第一穿孔，自第二表面朝第一表面延伸，并暴露导电垫；一导电结构，位于第二表面上与第一穿孔中，并接触导电垫，导电结构包含一第二导电层与一激光阻挡部分；一第一绝缘层，位于第二表面上并覆盖导电结构，其中第一绝缘层具有相对于第二表面的一第三表面；一第二穿孔，自第三表面朝第二表面延伸，并暴露激光阻挡部分；一第一导电层，位于第三表面上与第二穿孔中，并接触激光阻挡部分。本发明不仅可省略化学气相沉积与图案化第一绝缘层的制程，还可节省制程时间与机台成本，且可提升侦测时的准确度。
摘要（英）：

The invention provides a chip package and a fabrication method thereof. The chip package includes a chip, a first though hole, a conductive structure, a first isolation layer, a second though hole and a first conductive layer. The first though hole is extended from a second surface to a first surface to expose a conductive pad, and the conductive structure is on the second surface and extended to the first though hole to contact the conductive pad. The conductive structure includes a second conductive layer and a laser stopper. The first isolation layer is on the second surface and covering the conductive structure, and the first isolation layer has a third surface opposite to the second surface. The second though hole is extended from the third surface to the second surface to expose the laser stopper, and the first conductive layer is on the third surface and extended to the second though hole to contact the laser stopper. The chip package and the fabrication method thereof not only can omit the process for fabricating chemical vapor deposition and patterning the first isolation layer, but also can save the time for the process and the cost for the machine, and can improve the accuracy during the detection process.

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