To provide: an adhesive film in which a polyimide film and a fluorine-containing resin layer are directly laminated and the occurrence of swelling (foaming) in an atmosphere corresponding to solder reflow at a high temperature is minimized; and a flexible metal laminated plate. An adhesive film characterized in that: a fluorine-containing resin layer containing a fluorine-containing copolymer (A) is directly laminated on one or both surfaces of a polyimide film; the fluorine-containing copolymer (A) has a melting point of 280-320 DEG C, exhibits melt moldability, and has at least one functional group selected from the group comprising carbonyl-group-containing groups, hydroxy groups, epoxy groups, and isocyanate groups; and the fluorine-containing resin layer has a thickness of 1-20 [mu]m.