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发明授权
CN105798466B 陶瓷闪烁体阵列的加工方法 有权

陶瓷闪烁体阵列的加工方法
摘要：
本发明的陶瓷闪烁体阵列的加工方法具备如下步骤：（a）利用激光在闪烁体基片上在第一方向形成彼此平行并且间隔预定距离的预定数量的平直的第一方向通透切缝；（b）使用粘合剂充分填充所述第一方向通透切缝并使所述粘合剂固化；（c）利用激光在所述闪烁体基片上在与第一方向垂直的第二方向上以预定间隔形成预定数目的彼此平行的第二方向通透切缝；以及（d）使用粘合剂充分填充所述第二方向通透切缝并使所述粘合剂固化。
摘要（英）：

A method for processing a ceramic scintillator array, characterized in that, comprising the following steps: (a) forming, in a first direction, a predetermined number of straight first-direction through-cuts which are parallel to each other and spaced from each other on a scintillator substrate by using laser; (b) adequately filling the first-direction through-cuts with an adhesive and solidifying the adhesive; (c) forming, in a second direction. a predetermined number of second direction through-cuts which are parallel to each other at a predetermined interval on the scintillator substrate by using laser, wherein the second direction is perpendicular to the first direction; and (d) adequately filling the second direction through-cuts with the adhesive and solidifying the adhesive bond.

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