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发明公开
CN105826455A 一种LED驱动芯片保护装置及该装置的使用方法 无效 - 驳回

一种LED驱动芯片保护装置及该装置的使用方法
摘要：
本发明提供一种LED驱动芯片保护装置，包括LED成型膜腔、LED芯片安装支架、LED芯片保护支架和LED芯片保护罩，LED芯片安装支架上安装有LED芯片，LED成型膜腔内部放置有LED芯片安装支架和LED支架，LED芯片保护支架的顶端安装有LED芯片保护罩，本发明还提供一种LED驱动芯片保护装置的使用方法，包括以下步骤，灌胶，前烘烤，再处理，后烘烤，脱模，质检，裁剪和分光，与现有技术相比，本发明具有如下的有益效果：可有效避免 LED 驱动芯片受到热熔连接过程中高温的危害，保护了 LED 驱动芯片，保证了整体质量和使用寿命。
摘要（英）：

The invention provides an LED drive chip protection device comprising an LED molding cavity, an LED chip mounting bracket, an LED chip protection bracket, and an LED chip protection cover. An LED chip is mounted on the LED chip mounting bracket. The LED chip mounting bracket and an LED bracket are placed inside the LED molding cavity. The LED chip protection cover is mounted on the top end of the LED chip protection bracket. The invention further provides a using method of the LED drive chip protection device, comprising the steps of glue pouring, pre-baking, reprocessing, post-baking, de-molding, quality inspection, cutting, and beam splitting. Compared with the prior art, the beneficial effects are as follows: the harm of high temperature to LED drive chips in the hot-melt connection process is avoided effectively, LED drive chips are protected, and the overall quality and service life are ensured.

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