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发明授权
CN105845806B 发光器件封装 有权 转让

发光器件封装
摘要：
本发明提供了一种发光器件封装。该发光器件封装可以包括：发光器件，该发光器件包括至少一个发光二极管；以及主体，该主体包括至少一个引线框架，所述发光器件布置在该引线框架上，所述主体设有第一突起，该第一突起形成在所述主体的下表面上，其中，第一突起的下表面的宽度是第一突起的上表面的宽度的0.5倍至0.9倍。
摘要（英）：

The light emitting device package includes a light emitting device including at least one light emitting diode (140) and a body (110) including at least one lead frame (120,130) on which a light emitting device is disposed, the body provided a first protrusion (112) formed on a outside of the body, wherein the width (d1) of a lower surface of the first protrusion is 0.5 times to 0.9 times the width (d2) of an upper surface of the first protrusion.

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