The present invention is provided with: an insulating film (2); a thin-film thermistor unit (3) formed on the surface of the insulating film; a pair of interdigitated electrodes formed atop the thin-film thermistor unit; a pair of pad electrodes (5) formed on the surface of the insulating film; a pair of patterned wiring portions (6) having one end connected to the pair of interdigitated electrodes and the other end connected to the pair of pad electrodes; and a pair of lead frames (7) that are adhered to the pair of pad electrodes on the insulating film surface side. The thin-film thermistor unit is formed in a thermistor formation region (2a) that is disposed on the leading-end side of the insulating film, the pad electrodes are formed in an electrode formation region (2b) that is disposed on the base-end side of the insulating film, and the leading-end side of the pair of lead frames surrounds the periphery of the thermistor formation region without being in contact therewith.