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发明授权
CN105914203B 半导体模块、半导体装置以及半导体装置的制造方法 有权

半导体模块、半导体装置以及半导体装置的制造方法
摘要：
本发明涉及半导体模块、半导体装置以及半导体装置的制造方法，并提供一种能够效率地制造出使用多个不同种类的半导体装置的半导体模块的技术。第一半导体装置具有从第一密封树脂突出的第一至第三端子和第一半导体芯片。第二半导体装置具有从第二密封树脂突出的第四至第六端子和第二半导体芯片。第六端子未与第二半导体芯片连接。第一半导体装置与第二半导体装置被层叠从而构成半导体模块。第二端子与第五端子被排列为一列。第三端子与第六端子被排列为一列。第一配线沿着第二端子与第五端子的列延伸，并与第五端子连接。第二配线沿着第三端子与第六端子的列延伸，并与第三端子连接。
摘要（英）：

A semiconductor module includes: first semiconductor devices; second semiconductor devices; a first and second wires. Each first semiconductor device comprises: first sealing resin; first-third terminals; a first semiconductor chip connected to the first and third terminals. Each second semiconductor device comprises: second sealing resin; fourth-sixth terminals; a second semiconductor chip connected to the fourth and fifth terminals, and not connected to the sixth terminal. The first and second semiconductor devices are stacked along a stacking direction. The first terminals and the fourth terminals are arranged in a line along the stacking direction. The second terminals and the fifth terminals are arranged in a line along the stacking direction. The third terminals and the sixth terminals are arranged in a line along the stacking direction. The first wire is connected to the fifth terminals. The second wire is connected to the third terminals.

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