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发明授权
CN105916302B 防止绿油塞孔的PCB制造方法 有权

防止绿油塞孔的PCB制造方法
摘要：
一种防止绿油塞孔的PCB制造方法，包括以下步骤：(1)、阻焊前处理；(2)、丝印，在铜层上覆盖一层阻焊油墨；(3)、预烘，进行预加热；(4)、对位曝光，将需要阻焊的区域上所覆盖的阻焊油墨进行选择性紫外线曝光，形成一阻焊层；(5)、显影；(6)、返对位曝光，将PCB板除了功能孔之外的区域进行二次紫外线曝光；(7)、返显影，采用化学药水对功能孔内的阻焊油墨进行再次显影，以彻底清除功能孔内所残留的阻焊油墨；(8)、检板；(9)、后烘；(10)、对PCB板再次进行阻焊前处理、丝印、预烘、对位曝光、显影、返对位曝光、返显影、检板、后烘的工艺处理。本发明引进返曝光、返显影流程，有效解决绿油塞孔的问题。
摘要（英）：

Provided is a PCB (Printed Circuit Board) manufacturing method capable of preventing green oil hole plugging, comprising the steps of: (1) pre-welding treatment; (2) screen printing: forming a layer of solder resist ink on a copper layer; (3) preliminary baking: performing preheating; (4) counterpoint exposure: performing selective ultraviolet exposure on the solder resist ink covering the area needing solder resist to form a solder resist layer; (5) developing; (6) secondary counterpoint exposure: performing secondary ultraviolet exposure on the area except the function hole of a PCB; (7) secondary developing: employing chemical liquid medicine to perform secondary developing on solder resist ink in the function hole so as to thoroughly remove solder resist ink left in the function hole; (8) board checking; (9) postbaking; and (10) performing pre-welding treatment, screen printing, preliminary baking, counterpoint exposure, developing, secondary counterpoint exposure, secondary developing, board checking and postbaking again on the PCB. The method introduces secondary counterpoint exposure and secondary developing, and effectively solves the problem of hole plugging.

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