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发明授权
CN105925218B 复配型有机无机胶黏剂 有权 转让

复配型有机无机胶黏剂
摘要：
一种复配型有机无机胶黏剂，其包括70％至85％的聚四氟乙烯‑氧化淀粉‑醋酸乙烯三元共聚树脂；辅助抗氧剂，为亚磷酸三(2,4‑二叔丁基苯基)酯，含量为1～2％；增粘剂，为γ‑甲基丙烯酰氧基丙基三甲基硅烷，含量为10～15％；余量为相容剂与纳米无机填料的混合物，所述相容剂为纳米二氧化硅；所述纳米无机填料由植物纤维、纳米级硅酸钠、纳米级氧化铝以2：7：3质量份组成；本发明提出的复配型有机无机胶黏剂，其通过在有机胶黏剂中混合纳米无机填料形成复配型有机无机胶黏剂，使制得的胶黏剂既可用于无机材料的粘结，也能用于有机材料的粘结。
摘要（英）：

The invention relates to compound organic inorganic adhesive. The compound organic inorganic adhesive comprises 70-85% of polytetrafluoroethylene-oxidized starch-vinyl acetate ternary copolymer resin, 1-2% of an auxiliary antioxidant, namely tri(2,4-di-t-butylphenyl) phosphite, 10-15% of a tackifying agent, namely gamma-methylacryloyloxy propyl trimethylsilane, and the balance of mixture of a compatilizer and a nano inorganic filler, wherein the compatibilizer is nano silica, and the nano inorganic filler is composed of plant fibers, nanoscale sodium silicate and nanoscale aluminum oxide according to a ratio in parts by mass of 2:7:3. The compound organic inorganic adhesive provided by the invention is formed by mixing the inorganic filler in organic adhesive, so that the obtained adhesive can be used for bonding of inorganic materials and also can be used for bonding of organic materials.

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