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发明授权
CN105932145B 一种LED封装结构及其形成的灯串结构 有权 转让

一种LED封装结构及其形成的灯串结构
摘要：
本发明涉及一种LED封装结构，其具有透明导电材料，所述透明导电材料包括填充所述连接孔和浅沟槽的第一部分、部分填充所述深沟槽的第二部分以及在与深沟槽相对的第二侧面上凸出的第三部分，其具有包含第二部分和第一部分以连接第一和第三电极的第一导电路径，以及包含第三部分和第一部分以连接第二和第四电极的第二导电路径；凸出的所述第三部分与未填充透明导电材料的深沟槽的凹入部分形状相匹配。本发明可实现多个LED芯片串并联的灯串，易于更换，且方法简单。
摘要（英）：

The invention relates to an LED packaging structure having transparent conductive material. The transparent conductive material comprises a first portion filling connecting holes and shallow trenches, a second portion partially filling deep trenches, and a third portion projecting from a second side opposite to the deep trenches, and has a first conductive path including the second portion and the first portion to connect third and third electrodes and a second conductive path including the third portion and the first portion to connect second and fourth electrodes; the projecting third portion match in shape with concave portions of the deep trenches not filled with the transparent conductive material. The LED packaging structure enables a lamp string with multiple LED chips in series and parallel connection and is easy to replace, and a method is simple.

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