The invention discloses a system and method for laser cutting sapphire using multiple gas media. According to the invention, a system and a method are provided for manufacturing a sapphire part. A sapphire substrate 300 is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile 302 using a laser 402 and a first gas medium supplied by a gas delivery device 404. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.