The purpose of the present invention is to provide: an epoxy resin mixture having excellent heat resistance and thermal decomposition characteristics; a curable resin composition; and a cured product of the curable resin composition. An epoxy resin mixture according to the present invention contains a compound represented by formula (1) and a compound represented by formula (2), while containing a bifunctional epoxy resin in an amount of 20% by area or less in terms of an area percentage in a gel permeation chromatography (GPC) measurement chart and having a softening point of 80-110°C (in accordance with ISO 4625-2). (In formula (1), n represents the number of repetitions, and n is a number having an average value of 2-10. In addition, there is no case where all A moieties are the same.)