The embodiment of the invention provides a PCB electroplating system and related equipment thereof for solving the problem that an existing PCB electroplating system is likely to cause fires and is great in energy consumption. The system according to the embodiment of the invention comprises a wind-heat exchanger, an electroplating solution tank, a first circulating device and a second circulating device; an air-blowing main tube is embedded into the middle part of the wind-heat exchanger, a water return port is formed on the top of the wind-heat exchanger, and a water outlet is formed at the lower end of the wind-heat exchanger; an air-blowing pipe and a heat exchange coil are mounted in the bottom of the electroplating solution tank; the first circulating device comprises a high pressure fan, a main air-blowing pipe and a connecting pipe; the high pressure fan is connected to the air-blowing main pipe, the air-blowing main pipe is connected to the main air-blowing pipe, and the main air-blowing pipe is connected to the air-blowing pipe through a connecting pipe; the second circulating device comprises a water bath circulating pump connected to the water outlet, a hot water bath main water inlet pipe connected to the water bath circulating pump and a hot water bath main water return pipe, wherein the hot water bath main water inlet pipe is connected to the heat exchange coil, and the hot water bath main return pipe is connected to the water return port.