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发明公开
CN105992107A 用于电子设备中的部件的一体式框架 有权

用于电子设备中的部件的一体式框架
摘要：
本发明涉及用于电子设备中的部件的一体式框架。更具体而言，公开了一种电子设备，包括适于与音频驱动器一起使用的框架构件。框架构件可包括接收音频驱动器的凹陷区域。框架构件可以进一步包括包围凹陷区域的凸缘构件。框架构件可以由具有相对热导率系数的材料来形成。因此，框架构件能够消散由音频驱动器产生的热能(热量)。此外，框架构件可以按照允许框架构件将热能传递到外壳的方式位于电子设备的外壳中。此外，框架构件可包括铁磁材料，这可以使得框架构件以所需方式定向来自音频驱动器的磁体的磁通量。
摘要（英）：

An electronic device including a frame member suitable for use with an audio driver is disclosed. The frame member may include a recessed region that receives the audio driver. The frame member may further include a flange member surrounding the recessed region. The frame member may be formed from a material having a relatively high coefficient of thermal conductivity. Accordingly, the frame member can dissipate thermal energy (heat) generated from the audio driver. In addition, the frame member may be seated in an enclosure of an electronic device in a manner that allows the frame member to pass the thermal energy to the enclosure. Also, the frame member may include a ferromagnetic material, which may cause the frame member to direct magnetic flux from a magnet of the audio driver in a desired manner.

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