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发明公开
CN106024743A 空腔互连技术中的焊料 无效 - 驳回

空腔互连技术中的焊料
摘要：
互连技术可使用模制焊料来限定焊球。掩模层可被图案化，以便形成空腔和淀积在空腔中的焊膏。在加热时，形成焊球。空腔由间隔开的壁来限定，以便阻止焊球在接合过程中桥接。在一些实施例中，连接到焊球的焊料凸块可具有比焊球的相对面更大的相对面。
摘要（英）：

The present invention discloses a solder in cavity interconnection Technology which uses molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

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