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CN106033755A 具有电磁干扰屏蔽的半导体器件和基板带 无效 - 驳回

具有电磁干扰屏蔽的半导体器件和基板带
摘要：
公开了半导体器件和基板带。半导体器件包括基板以及设置在基板的表面上的导电阻挡，所述基板包括在基板的表面上的接地的导电图案，接地的导电图案围绕目标区域。导电阻挡电连接到接地的导电图案并为目标区域在基板的表面的横向方向上提供电磁干扰(EMI)屏蔽。
摘要（英）：

A semiconductor device and a substrate band are disclosed. The semiconductor device comprises a substrate and a conductive block arranged on a surface of the substrate. The substrate comprises a grounded conductive pattern on the surface of the substrate. The grounded conductive pattern surrounds a target area. The conductive block is electrically connected to the grounded conductive pattern and provides electromagnetic interference (EMI) shielding for the target area at a transverse direction of the surface of the substrate.

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