The invention relates to the field of cooling copper pipe devices, in particular to a novel condensing system for cooling copper pipes. The novel condensing system for the cooling copper pipes comprises a heat absorbing end, a heat conducting copper pipe, an enhanced cooling plate, a fin and a fan. The heat absorbing end is made from heat conducting materials and makes contact with a heating element. One end of the heat conducting copper pipe makes contact with the heat absorbing end, and the other end of the heat conducting copper pipe makes contact with the enhanced cooling plate. The enhanced cooling plate is arranged within the range of eddies generated by rotation of the fan and comprises a plurality of cooling protruding points and an eddy air duct opening, wherein cooling protruding points are all arranged on the enhanced cooling plate, and the eddy air duct opening is formed in the center of the enhanced cooling plate. The novel condensing system for the cooling copper pipes has the beneficial effects that under the conditions that the number or length of the enhanced cooling plate is not increased and the power of the fan is not improved, the cooling protruding points are additionally arranged on the enhanced cooling plate, and thus the cooling area can be enlarged, and the cooling efficiency can be improved.