The present invention is a connection method in which said connection method, which performs anisotropic conductive connection between terminals (1) of a ceramic substrate (2) and terminals of an electronic component, includes steps for: application, which applies anisotropic conductive films upon the terminals (1) of the ceramic substrate (2); mounting, which mounts the electronic component upon the anisotropic conductive films; and hot-pressing, which heats and presses the electronic component, using a hot-pressing member, with a pressure of less than 2 MPa. Height variation of the ceramic substrate (2) is greater than or equal to 20 μm, and the anisotropic conductive films contain a radical-polymerizable material, a thermal radical initiator, and conductive particles of an average particle size of greater than or equal to 13 μm.