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发明公开
CN106098572A 一种钝化层制造方法及高压半导体功率器件 审中-实审

一种钝化层制造方法及高压半导体功率器件
摘要：
本发明提供了一种钝化层制造方法及高压半导体功率器件，所述方法包括通过丝网印刷在高压半导体功率器件上涂覆聚酰亚胺胶；对聚酰亚胺胶进行前烘和固化形成聚酰亚胺保护层；高压半导体功率器件采用上述方法制造。与现有技术相比，本发明提供的一种钝化层制造方法及高压半导体功率器件，不仅提高了半导体功率器件钝化层制造的工作效率并降低了工作成本，还提高了高压半导体功率器件的工作稳定性。
摘要（英）：

The invention provides a manufacturing method for a passivation layer and a high-voltage semiconductor power device. The method comprises: a high-voltage semiconductor power device is coated with a polyimide adhesive by silk-screen; and pre baking and solidification are carried out on the polyimide adhesive to form a polyimide protection layer. And a high-voltage semiconductor power device is manufactured by using the method. Compared with the prior art, the provided manufacturing method and high-voltage semiconductor power device have the following beneficial effects: the working efficiency for manufacturing a passivation layer of a semiconductor power device is improved; the working costs are lowered; and the working stability of the high-voltage semiconductor power device is improved.

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