The invention discloses a soldering process of a copper-aluminum transition wire clip. The soldering process comprises the following steps of S1, selecting an aluminum plate, and milling a R groove in a top surface of the aluminum plate; S2, selecting a semi-circle copper pipe; S3, cleaning the aluminum plate; S4, cleaning the semi-circle copper pipe; S5, placing the semi-circle copper pipe and the aluminum plate on an electric furnace for heating to be 400-450 DEG C for use; S6, preparing a tin solution and a zinc solution; S7, preparing a copper pipe impregnation liquid; S8, immersing the heated semi-circle copper pipe in the copper pipe impregnation liquid; S9, immersing the heated aluminum plate in the step S5 and the semi-circle copper pipe in the step S8 in a mixture liquid in a tin pot, taking out the aluminum plate and placing the aluminum plate on a workbench; and S10, preparing the copper-aluminum transition wire clip, wherein the semi-circle copper pipe fully adhered with the tin solution and the zinc solution is firstly taken out of the pot in the step S9, secondly, the semi-arc of the semi-circle copper pipe is aligned to the semi-arc of the R groove in the aluminum plate on the workbench, and finally, the semi-circle copper pipe is pressed by a press block for 5-10 seconds to discharge air of a contact part. The soldering process has the advantages of simplicity and low production cost, a phenomenon that the copper pipe falls off at 170 DEG C is prevented, and the connection rate of the copper pipe and the aluminum plate can be enabled to reach 95%.