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发明授权
CN106105404B 可挠性安装模块体的制造方法 有权

可挠性安装模块体的制造方法
摘要：
使采用各向异性导电膜（12）的电子部件（9）与电极（6）之间的电连接可靠。先在可挠性基板（11）的安装区域（10）的背面侧粘贴粘附膜（20），在表面侧搭载电子部件（9）。粘附膜（20）在基体材料膜（22）上形成有粘附剂层（21），在粘附剂层（21）的粘附剂（26）中，含有一次粒径小于100nm的硅石微粒子（25），在160℃中的剪切储能模量为0.15MPa以上。在安装区域（10）上配置各向异性导电膜（12）并在其上加热扩按压而搭载电子部件（9）时，粘附剂层（21）中的粘附剂（26）不会挤出很多，而夹在凸块（13）与电极（6）之间的导电粒子（19）被按压而压垮，因此电连接变得可靠。
摘要（英）：

An adhesive film including a substrate film and an adhesive agent layer formed thereon is adhered to the back surface side of a mounting region of a flexible substrate, and an electronic component is mounted on the front surface side. An adhesive agent in the adhesive agent layer contains silica fine particles having a primary particle diameter of less than 100 nm, and the adhesive agent layer has a shear storage elastic modulus at 160° C. of 0.15 MPa or more. When the anisotropic conductive film is disposed on the mounting region and the electronic component is mounted on the anisotropic conductive film by heating and pressing, the adhesive agent is not pushed out to a large extent, and conductive particles sandwiched between a bump on the electronic component and the electrode are pressed and squashed, improving an electrical connection between the electronic component and the electrode.

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