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发明公开
CN106119911A 稳定型电镀液 无效 - 撤回

稳定型电镀液
摘要：
本发明公开了一种稳定型电镀液，包括电镀液本体，电镀液本体由以下组份组成：锡酸钠15‑30g/L、磷酸氢钠25‑35g/L、亚硝酸钠40‑60g/L、氢氧化钾25‑40g/L、氰化钾15‑25g/L、硫酸铜30‑50g/L、氧化锌10‑25g/L和柠檬酸10‑25g/L，所述电镀液本体混合时由锡酸钠、磷酸氢钠和亚硝酸钠混合溶液加入到氢氧化钾、硫酸铜、氰化钾、氧化锌和柠檬酸混合的溶液中形成。通过上述方式，本发明能够提高电镀液的稳定性，电镀液配料时分批次混合，避免反应液提前反应，提高了电镀液的温度安全性。
摘要（英）：

The invention discloses a stable electroplating solution which comprises an electroplating solution body; and the electroplating solution body is prepared from the following components: 15 to 30g/L of sodium stannate, 25 to 35g/L of sodium hydrogen phosphate, 40 to 60g/L of sodium nitrite, 25 to 40 g/L of potassium hydroxide, 15 to 25 g/L of potassium cyanide, 30 to 50 g/L of copper sulfate, 10 to 25 g/L of zinc oxide and 10 to 25 g/L of citric acid, and is obtained by adding a mixed solution of sodium stannate, sodium hydrogen phosphate and sodium nitrite into a mixed solution of potassium hydroxide, copper sulfate, potassium cyanide, zinc oxide and citric acid. Therefore, the stability of the electroplating solution can be improved; and as the components are mixed in batches, pre-reactions of the reaction liquids (components) are avoided in advance, and the temperature safety of the electroplating solution is improved.

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