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发明公开
CN106205642A 布线薄板、挠曲件以及焊接的方法 有权

布线薄板、挠曲件以及焊接的方法
摘要：
本发明提供一种布线薄板，即使布线薄板被缩小且包括变宽的布线轨迹，其也能将布线薄板牢固地按在要作为焊接点的预定部周围。布线薄板包括金属支撑层、在支撑层上的绝缘层、具有在绝缘层上的多个布线轨迹的布线部分、被限定于要被焊接的支撑层上的预定部以及被形成于支撑层上用于预定部且具有与布线部分相同的高度的凸起部。
摘要（英）：

Provided is a wiring thin plate capable of securely hold-down the wiring thin plate around a scheduled portion to be a welded spot even if the wiring thin plate is downsized and involves widened wiring traces. The wiring thin plate includes a metal supporting layer, an insulating layer on the supporting layer, a wiring part having a plurality of wiring traces on the insulating layer, a scheduled portion defined on the supporting layer to be welded, and a protrusion formed on the supporting layer for the scheduled portion and having a height that is the same as a height of the wiring part.

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