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发明公开
CN106206988A 封装结构及其制备方法、以及应用 有权

封装结构及其制备方法、以及应用
摘要：
本发明涉及一种封装结构及其制备方法、以及应用。上述封装结构设置于被封装器件外，封装结构包括：基板；盖板，与基板相对设置；封装玻璃料，位于基板与盖板之间，以及导热条，设置在封装玻璃料上，且延伸方向与封装玻璃料的延伸方向相同。上述封装结构中，由于封装玻璃料上设置有延伸方向与沿封装玻璃料的延伸方向相同的导热条，能够引导激光散射和封装玻璃料熔融态热辐射的大部分能量沿导热条的延伸方向传导，则将激光散射和封装玻璃料熔融态热辐射的大部分能量传导至封装玻璃料内，减少了沿封装玻璃料的宽度方向传导的热量，从而减少了对靠近封装玻璃料区域的封装边缘处的有机膜的影响，从而提高了显示装置的封装边缘的均匀性。
摘要（英）：

The invention relates to a package structure and a preparation method and application thereof. The package structure is arranged outside a packaged device. The package structure comprises a substrate, a cover plate, a package glass material and heat conducting strips, wherein the cover plate is arranged opposite to the substrate; the package glass material is positioned between the substrate and the cover plate; and the heat conducting strips are arranged on the package glass material, and the extending directions of the heat conducting strips are the same as the extending direction of the package glass material. In the package structure, due to the fact that the heat conducting strips with the extending directions which are the same as the extending direction of the package glass material are arranged on the package glass material, most of energy for laser scattering and package glass material molten state heat radiation can be guided to conduct along the extending directions of the heat conducting strips, so that the most of energy for laser scattering and package glass material molten state heat radiation is conducted into the package glass material, the heat conducted along the width direction of the package glass material is reduced, the influence on an organic film at the position a package edge close to the area of the package glass material is reduced, and the uniformity of the package edge of a display device is improved.

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