利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN106221666A 一种高导热、高粘接强度有机硅灌封胶及其制备方法和其封装电机端部的方法 有权 转让

一种高导热、高粘接强度有机硅灌封胶及其制备方法和其封装电机端部的方法
摘要：
一种本发明的高导热、高粘接强度有机硅灌封胶，包括A组分和B组分，以重量份计，A组分主要由以下原料混合制备而成：乙烯基硅油50～150份、含氢硅油0.1～10份、抑制剂0.1～1份、MQ硅树脂1～30份、硅烷偶联剂0.1～10份、气相二氧化硅0.1～10份、表面活性剂0.1～10份、导热填料50～400份；B组分主要由以下原料混合制备而成：乙烯基硅油10～200份、催化剂0.1～1份、增粘剂0.1～10份、气相二氧化硅0.1～10份、表面活性剂0.1～10份、导热填料50～400份。本发明的有机硅灌封胶具有高粘接强度、高导热机械性能好、电性能优异等优点。
摘要（英）：

A high-heat-conductive and high-adhesion-strength organic silicon pouring sealant includes a component A and a component B, wherein the component A is mainly prepared by mixing the raw materials including, by weight, 50-150 parts of vinyl silicon oil, 0.1-10 parts of hydrogen-containing silicon oil, 0.1-1 part of an inhibitor, 1-30 parts of MQ silicone resin, 0.1-10 parts of a silane coupling agent, 0.1-10 parts of fumed silica, 0.1-10 parts of a surfactant, and 50-400 parts of a heat-conductive filler; and the component B is mainly prepared by mixing the raw materials including, by weight, 10-200 parts of vinyl silicon oil, 0.1-1 part of a catalyst, 0.1-10 parts of a tackifier, 0.1-10 parts of fumed silica, 0.1-10 parts of the surfactant, and 50-400 parts of the heat-conductive filler. The organic silicon pouring sealant has high adhesion strength, high heat conductivity, good mechanical performance and excellent electric performance.

公开/授权文献
0/0