The invention relates to a high-density radio frequency multi-chip packaging structure comprising a substrate (1), a substrate (2), a substrate (3), a housing (4), a chip (5), a chip (6), a chip (7), and a chip (8). The housing (4) is assembled on the substrate (1) and the housing (4) and the substrate (1) form a space by encircling; and the substrate (2), the substrate (3), the chip (5), the chip (6), the chip (7), and the chip (8) are arranged in the space. The chip (6) is assembled on the substrate (1); the chip (8) is assembled on the substrate (2) and is connected with the substrate (1) by the substrate (2); the chip (5) is assembled on the housing (4); the chip (7) is assembled on the substrate (3) and is connected with the housing (4) by the substrate (3). Therefore, three-dimensional mixed high-density integration is carried out on a plurality of active chips and a plurality of passive devices.