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发明公开
CN106252498A 一种LED背光源散热基板材料的制备方法 有权 转让

一种LED背光源散热基板材料的制备方法
摘要：
本发明涉及一种LED背光源散热基板材料的制备方法，属于散热基板材料制备技术领域。本发明主要是用氮化铝陶瓷粉末、铝粉、硅藻土为主要原料压制成坯料，再对其进行煅烧和退火，得到氮化铝陶瓷复合基板，接着分别对其进行碱洗、酸泡和敏化处理，得到敏化后的氮化铝陶瓷复合基板，再将环氧树脂制备得到的导热聚合物涂覆于敏化后的氮化铝陶瓷复合基板，经固化即可得到LED背光源散热基板材料，本发明制备的LED背光源散热基板材料导热系数高，达到62W/m·K以上，具有很好的散热性能，绝缘性能好，表面电阻值大于15MΩ。
摘要（英）：

The invention relates to a preparation method of an LED backlight source heat dissipation substrate material and belongs to the heat dissipation substrate material preparation technical field. According to the preparation method, aluminum nitride ceramic powder, aluminum powder and diatomite are selected as main raw materials and are pressed into a blank; calcination and annealing are performed on the blank, so that an aluminum nitride ceramic composite substrate is obtained; alkaline washing, acid immersion and sensitization treatment are performed on the aluminum nitride ceramic composite substrate, so that a sensitized aluminum nitride ceramic composite substrate can be obtained; thermal conductive polymer made of epoxy resin is applied onto the sensitized aluminum nitride ceramic composite substrate; and after curing is carried out, the LED backlight source heat dissipation substrate material can be obtained. The heat conductivity coefficient of the LED backlight source heat dissipation substrate material prepared by using the preparation method is high and can be higher than 62W/m.K. The LED backlight source heat dissipation substrate material has excellent heat dissipation performance and good insulation performance; and the surface resistance value of the LED backlight source heat dissipation substrate material is higher than 15 megohms.

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