The invention discloses a modified epoxy molding compound for an integrated circuit and a preparation method of the modified epoxy molding compound. The molding compound is prepared from components as follows: cyanuric acid epoxy resin, ACR resin, perfluorosulfonate resin, 107 rubber powder, silicone powder, a modified additive, zinc dialkyl dithiophosphate, magnesium picolinate, n-butyl nicotinate (3-pyridine butyl formate), 4-(methylaminomethyl)benzonitrile, cashew nut shell oil, heptadecyl imidazoline, 2,3-difluorophenylboronicacid, tri-octyl tri-meta-benzoate, diisoste aroylethylene titanate and polyethylene glycol oleate. The linear expansion coefficient, the mechanical property and the heat resistance of the provided modified epoxy molding compound all reach the higher level, the reliability is good, and the requirements of an electronic packaging technology can be met.