The invention provides a rare earth modified brushing electroplating silver plating solution. The rare earth modified brushing electroplating silver plating solution comprises following components including, by mass concentration, 10 g/L to 30 g/L of silver salt, 0.1 g/L to 2 g/L of modifying agent rare earth cerous nitrate, 50 g/L to 200 g/L of coordination agent sulfosalicylic acid, 50 g/L to 200 g/L of imidazole, 0.01 g/L to 1 g/L of protection agent hexamethylenetetramine, 0.01 g/L to 1 g/L of addition agent N,N-dimethylformamide, 1 g/L to 30 g/L of polyethylene glycol, 10 g/L to 50 g/L of ammonium hydroxide, 10 g/L to 40 g/L of stabilizing agent ammonium acetate and 5 g/L to 30 g/L of potassium pyrophosphate. The pH value of the solution is adjusted to range from 6.8 to 7.2 through dilute nitric acid or dilute sodium hydroxide. The invention further provides a preparing technology and use method of the rare earth modified brushing electroplating silver plating solution. The harmfulless silver salt, a rare earth modification agent, a coordination agent, a protection agent and the like are mixed for forming the solution, the solution is a neutral cyanide-free silver plating solution, raw materials are easily obtained, and the preparing technology is simple. A product is applied to a copper or copper alloy surface to be subject to brushing electroplating, the method is simple and easy to operate, and a plating is stable.