It is an object of the present invention to suppress the generation of burrs in the cutting process. A cutting grinding apparatus (65) for cutting a processed object (W) is a cutting grinding apparatus having a boron compound in which cBN abrasive grains as a boron compound and ZrB2 particles as metal borides are added to the diamond abrasive grains, and is fixed by a resin binder composed of a phenolic resin or the like.