Disclosed is a finger fracture reduction apparatus. The finger fracture reduction apparatus is characterized by comprising a pair of forceps with a locating structure, two splints which are arranged on a tong head part and are driven by the tong heads on two side of the forceps, supports connected to the splints, sleeves which are arranged on the supports and are diagonally opposite to a center line between the two splints, guide sleeves which are arranged in the sleeves and are used for guiding a kirschner wire, wherein narrow slits are arranged in the inner side of the sleeves and the width of the slits is larger than the diameter of the kirschner wire and smaller than the external diameter of the guide sleeves. Compared with the prior art, the finger fracture reduction apparatus has the advantages that the kirschner wire can be accurately infiltrated into the fracture reduction part so as to fix the fracture part after the reduction is carried out.