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Invention Grant
CN106463520B 成像探测器模块组件 有权

成像探测器模块组件
Abstract:
一种模块组件设备(402)被配置用于组装用于成像系统(100)的探测器阵列(110)的模块组件(114)。所述模块组件设备包括具有长轴(401)的基底(400)。所述模块组件设备还包括所述基底的第一表面(406)以及从所述第一表面垂直向上凸起并沿着所述基底的至少两侧在长轴的方向上延伸的侧壁(408)。所述第一表面和侧壁形成凹槽(404)，所述凹槽被配置为在所述表面上并且在所述侧壁内接收模块衬底。所述模块组件设备还包括在所述侧壁的方向上从所述侧壁凸起的凸起部(403)。凸起部和侧壁接合以形成壁架，所述壁架充当光探测器阵列单片支撑物(410)，所述光探测器阵列单片支撑物被配置为在ASIC和模块衬底之上接收光探测器阵列单片(118)。
Abstract(English):

A module assembly device (402) is configured for assembling a module assembly (114) for a detector array (110) of an imaging system (100). The module assembly device includes a base (400) having a long axis (401). The module assembly device further includes a first surface (406) of the base and side walls (408) protruding perpendicular up from the first surface and extending in a direction of the long axis along at least two sides of the base. The first surface and side walls form a recess (404) configured to receive the module substrate on the surface and within the side walls. The module assembly device further includes protrusions (403) protruding from the side walls in a direction of the side walls. The protrusions and side walls interface forming a ledge which serves as a photo-detector array tile support (410) configured to receive the photo-detector array tile (118) over the ASIC and the module substrate.

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