The invention provides a cut-off device. The cut-off device has a cutting-off bar capable of simply adjusting the parallelism of the top edge ridge of a pressing edge and the surface of a substrate without using a pad or the like. The cut-off device (A) includes a workbench (1), a mounting substrate (W), and a cut-off bar (10) arranged above the workbench (1), wherein the cut-off bar (10) has a plurality of pressing plates (14) arranged in a linear mode and gaps provided between the pressing plates (14).