The invention relates to a preparation method for a paper-based copper-clad plate, and belongs to the technical field of production of copper-clad plates. According to the method, alumina, aluminum nitride, boron nitride, silicon nitride, silicon carbide and the like are added in a processing process of bleached wood pulp paper, so that high thermal conductivity is achieved, and the shortcoming of low thermal conductivity of existing paper used for the paper-based copper-clad plates as a reinforcing material is overcome; in terms of resin formula, a phenolic resin and a low-bromine-content or bromine-free epoxy resin are taken as main body resins, and a certain toughening agent and a certain amount of filler with high thermal conductivity and other functional filler are added, so that various comprehensive performance of the plate is improved.