The invention provides a chip board-level packaging structure and a manufacturing method. The packaging structure comprises a substrate, an IGBT chip and a driving chip, first dielectric layers, second dielectric layers, metal seed layers and second metal coatings, wherein at least two accommodating spaces are formed on the substrate; the IGBT chip and the driving chip are embedded into the corresponding accommodating spaces respectively; the first dielectric layers are formed on the surface of the substrate, the surface of the IGBT chip and the surface of the driving chip, at least a part of electrodes of the IGBT chip and the driving chip are exposed and are covered with first metal coatings, and the grid electrode of at least one IGBT chip is electrically connected with the control electrode of the driving chip through a first line layer formed by the first metal coatings; the first dielectric layer and the first line layer are covered with the second dielectric layers, and the first metal coatings above the source electrode and the drain electrode of the IGBT chip are exposed; the metal seed layers are formed on the first metal coatings; and the second metal coatings are formed on the second dielectric layer and the metal seed layer. According to the chip board-level packaging structure and the manufacturing method provided by the embodiment of the invention, the electrical properties of the chip packaging structure is effectively improved.