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发明公开
CN106559957A 软硬结合板及手机摄像模组 审中-实审

软硬结合板及手机摄像模组
摘要：
本发明公开了一种软硬结合板及手机摄像模组，通过在常规手机摄像模组上所使用的有机软硬结合板中的对应图像传感器的位置进行挖空处理，然后在背面贴上补强钢片；图像传感器在粘晶的时候可放入挖空的下沉槽中，这样，在手机摄像模组TTL不变的情况下，可降低整个手机摄像模组的高度，同时由于图像传感器与钢片接触，由于钢片的平整度比PCB板材表面的平整度要平很多，因此，可减少因PCB板材平整度而造成的图像传感器成像质量差的问题；另外，由于图像传感器是一种发热量很大的感光芯片，而钢片的散热性比FR4等PCB材质要好的多，所以本发明还可以减少手机在正常摄像过程中过热的问题。
摘要（英）：

The invention discloses a rigid-flex board and a mobile phone camera module; a position corresponding to an image sensor in an organic rigid-flex board applied in a normal mobile phone camera module is hollowed, and a reinforcing steel sheet is attached on the backside; the image sensor can be placed in the hollowed sink slot in a wafer bonding process, thus reducing the height of the whole mobile phone camera module without changing the mobile phone camera module TTL; in addition, the image sensor makes contacts with the steel sheet; the flatness of the steel sheet is much better than that of the surface of a PCB board, thus solving the poor imaging quality problems, caused by the flatness of the PCB board, of the image sensor; in addition, the image sensor is a photosensitive chip with large caloric power, the thermal diffusivity FR4 of the steel sheet is much better than the PCB board, so the overheating problems of the mobile phone in a normal shooting process can be reduced.

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