The present application pertains to a conductive structure and a preparation method therefor. A conductive structure according to one embodiment of the present application comprises: a substrate; a metal layer provided on the substrate and comprising copper; an anti-tarnishing layer provided on the metal layer; and a darkened layer provided on the anti-tarnishing layer and comprising one or more of copper oxide, copper nitride, copper oxynitride, aluminum oxide, aluminum nitride and aluminum oxynitride.