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发明公开
CN106716622A 信号传送绝缘设备以及功率半导体模块 有权

信号传送绝缘设备以及功率半导体模块
摘要：
使信号传送绝缘设备具备：第1线圈；第2线圈，与第1线圈对置，与第1线圈构成变压器；第1绝缘膜，在对置的第1线圈和第2线圈之间，由第1电介质构成；第2绝缘膜，包围第1线圈，由电阻率比第1电介质低的第2电介质构成；以及第3绝缘膜，包围第2线圈，由电阻率比第1电介质低的第3电介质构成，或者使信号传送绝缘设备具备：第1线圈；第2线圈，与第1线圈对置，与第1线圈构成变压器；第1绝缘膜，在对置的第1线圈和第2线圈之间，由第1电介质构成；第2绝缘膜，包围第1线圈，由介电常数比第1电介质高的第2电介质构成；以及第3绝缘膜，包围第2线圈，由介电常数比第1电介质高的第3电介质构成。
摘要（英）：

A signal transmission insulative device is provided with: a first coil; a second coil facing the first coil and forming a transformer with the first coil; a first insulation film comprising a first dielectric body in the space where the first coil and the second coil face one another; a second insulation film surrounding the first coil and comprising a second dielectric body that has a resistivity lower than the first dielectric body; and a third insulation film surrounding the second coil and comprising a third dielectric body that has a resistivity lower than the first dielectric body. Or, the signal transmission insulative device is provided with: a first coil; a second coil facing the first coil and forming a transformer with the first coil; a first insulation film comprising a first dielectric body in the space where the first coil and the second coil face one another; a second insulation film surrounding the first coil and comprising a second dielectric body that has a dielectric constant higher than the first dielectric body; and a third insulation film surrounding the second coil and comprising a third dielectric body that has a dielectric constant higher than the first dielectric body.

公开/授权文献
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70 .由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77 ..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78 ...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82 ....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822 .....衬底是采用硅工艺的半导体的（H01L21/8258优先）
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