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发明公开
CN106751464A 一种LED封装用抗氧化高导热复合材料及其制备方法 无效 - 驳回

一种LED封装用抗氧化高导热复合材料及其制备方法
摘要：
本发明公开了一种LED封装用抗氧化高导热复合材料，由以下重量份的原料制备得到：酚醛环氧树脂70‑80、聚苯乙烯粉料18‑22、羟基硅油0.1‑0.2、纳米钛白粉4‑5、3‑甲氧基‑4‑羟基苯乙醇0.1‑0.2、马来酸酐0.4‑0.5、纳米水滑石0.4‑0.5、硅烷偶联剂0.1‑0.2、氯仿适量、抗氧剂0.01‑0.02、固化剂DDS20‑25。本发明制备的复合材料作为LED封装材料具有优良的力学性能和介电性能，抗氧化，高导热，使用寿命长，经济耐用。
摘要（英）：

The invention discloses an anti-oxidization high-thermal-conductivity composite material for LED encapsulation. The anti-oxidization high-thermal-conductivity composite material is prepared from the following raw materials in parts by weight: 70-80 parts of phenolic epoxy resin, 18-22 parts of polystyrene powder, 0.1-0.2 part of hydroxyl silicone oil, 4-5 parts of nano titanium dioxide, 0.1-0.2 part of 3-methoxy-4-hydroxyphenethyl alcohol, 0.4-0.5 part of maleic anhydride, 0.4-0.5 part of nano hydrotalcite, 0.1-0.2 part of a silane coupling agent, a proper amount of chloroform, 0.01-0.02 part of an anti-oxidant and 20-25 parts of a curing agent DDS. The composite material is used as an LED encapsulation material, has excellent mechanical properties and dielectric properties, is resistant to oxidization, is high in heat conduction, is long in service life, and is economical and durable.

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