The invention relates to a halogen-free resin composition and a prepreg and a copper-clad plate produced therefrom. The halogen-free resin composition comprises the following components: 100 parts of halogen-free non-phosphorus epoxy resin, 2-50 parts of curing agent, 0.1-3 parts of curing accelerator, 15-28 parts of flame retardant, and 35-55 parts of solvent. The resin composition in the invention is simple in process and low in production cost. The resin composition is halogen-free and may achieve a 'green' flame-retarding effect. A copper-clad plate produced according to the invention has the characteristics of high CTI greater than or equal to 600 V and high peel strength greater than or equal to 1.90 N/mm.