The invention provides a processing device for microstructure etching. The device comprises a driving device, a reaction device and an operating table. The driving device comprises a rotary device and a six-degree-of-freedom motion platform. The rotary device is arranged on the six-degree-of-freedom motion platform. The reaction device comprises a reaction box, heating pasters, a stirring magnet exciting coil, a special magnetic stirring plate, a plurality of layers of wafer supports, spraying devices and a detection and regulation device. The bottom of the reaction box is connected with the rotary device, and an etchant injection/immission opening is formed in the bottom of the rotary device. The stirring magnet exciting coil is arranged under the reaction box and connected with the upper end of the six-degree-of-freedom motion platform. The special magnetic stirring plate is arranged in an installation groove in the bottom in the reaction box. The wafer supports are horizontally erected in the reaction box in a layered mode. The spraying devices are arranged on the wafer supports. The detection and regulation device is arranged on the side wall of the reaction box. By means of the processing device for etching, complex microstructures in the semiconductor industry can be easily and efficiently processed.